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来源类型Working Paper
规范类型报告
DOI10.3386/w20587
来源IDWorking Paper 20587
Patent Collateral, Investor Commitment, and the Market for Venture Lending
Yael V. Hochberg; Carlos J. Serrano; Rosemarie H. Ziedonis
发表日期2014-10-13
出版年2014
语种英语
摘要The use of debt to finance risky entrepreneurial-firm projects is rife with informational and contracting problems. Nonetheless, we document widespread lending to startups in three innovation-intensive sectors and in early stages of development. At odds with claims that the secondary patent market is too illiquid to shape debt financing, we find that intensified patent trading increases the annual rate of startup lending, particularly for startups with more redeployable (less firm-specific) patent assets. Exploiting differences in venture capital (VC) fundraising cycles and a negative capital-supply shock in early 2000, we also find that the credibility of VC commitments to refinance and grow fledgling companies is vital for such lending. Our study illuminates friction-reducing mechanisms in the market for venture lending, a surprisingly active but opaque arena for innovation financing, and tests central tenets of contract theory.
主题Financial Economics ; Financial Institutions ; Industrial Organization ; Market Structure and Firm Performance ; Firm Behavior ; Development and Growth ; Development ; Innovation and R& ; D
URLhttps://www.nber.org/papers/w20587
来源智库National Bureau of Economic Research (United States)
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资源类型智库出版物
条目标识符http://119.78.100.153/handle/2XGU8XDN/578260
推荐引用方式
GB/T 7714
Yael V. Hochberg,Carlos J. Serrano,Rosemarie H. Ziedonis. Patent Collateral, Investor Commitment, and the Market for Venture Lending. 2014.
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